solder                 package:rpart                 R Documentation

_S_o_l_d_e_r_i_n_g _o_f _C_o_m_p_o_n_e_n_t_s _o_n _P_r_i_n_t_e_d-_C_i_r_c_u_i_t _B_o_a_r_d_s

_D_e_s_c_r_i_p_t_i_o_n:

     The `solder' data frame has 720 rows and 6 columns, representing a
     balanced subset of a designed experiment varying 5 factors on the
     soldering of components on printed-circuit boards.

_U_s_a_g_e:

     data(solder)

_F_o_r_m_a_t:

     This data frame contains the following columns:

     `_O_p_e_n_i_n_g' a factor with levels `L'  `M'  `S' indicating the amount
          of clearance around the mounting pad.

     `_S_o_l_d_e_r' a factor with levels `Thick'  `Thin' giving the thickness
          of the solder used.

     `_M_a_s_k' a factor with levels `A1.5'  `A3'  `B3'  `B6' indicating
          the type and thickness of mask used.

     `_P_a_d_T_y_p_e' a factor with levels `D4'  `D6'  `D7'  `L4'  `L6'  `L7' 
          `L8'  `L9'  `W4'  `W9' giving the size and geometry of the
          mounting pad.

     `_P_a_n_e_l' `1:3' indicating the panel on a board being tested.

     `_s_k_i_p_s' a numeric vector giving the number of visible solder
          skips.

_S_o_u_r_c_e:

     John M. Chambers and Trevor J. Hastie eds. (1992) Statistical
     Models in S, Wadsworth and Brooks/Cole, Pacific Grove, CA 1992.

_E_x_a_m_p_l_e_s:

     data(solder)
     fit <- rpart(skips ~ Opening + Solder + Mask + PadType + Panel,
            data=solder, method='anova')
     summary(residuals(fit))
     plot(predict(fit),residuals(fit))

